| PART |
Description |
Maker |
| MC-7832-HA MC-7832-HA-AZ |
GaAs MULTI-CHIP MODULE
|
NEC
|
| TH50VSF3582AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| TH50VSF4682AASB TH50VSF4683AASB |
MULTI-CHIP INTEGRATED CIRCUIT SILICON GATE CMOS SRAM AND FLASH MEMORY MIXED MULTI-CHIP PACKAGE
|
TOSHIBA
|
| AT68166HT-YS18-MQ AT68166HT-YS20-E AT68166HT-YS20- |
Rad Hard 16 MegaBit 3.3V 5V Tolerant SRAM Multi-Chip Module
|
ATMEL Corporation
|
| WE128K32-XH1X WE128K32-XG2TX WE128K32NP-200H1Q WE1 |
EEPROM MCP
128K X 32 EEPROM 5V MODULE, 200 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 120 ns, CPGA66 1.075 x 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 150 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 140 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 250 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Microsemi, Corp.
White Electronic Designs, Corp.
|
| SMFLHP283R3S SMFLHP2805D SMFLHP2812D SMFLHP2805D07 |
Parallel operation with current share, up to 3 units (228 watts)
2-OUTPUT 100 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12
2-OUTPUT 80 W DC-DC REG PWR SUPPLY MODULE HERMETIC SEALED PACKAGE-12
|
Interpoint Corporation Company
Standard Power
|
| FDMF8704 |
High Efficiency / High Frequency FET plus Driver Multi-chip Module
|
Fairchild Semiconductor
|
| MC-7833 MC-7833-AZ |
GaAs MULTI-CHIP MODULE
40 MHz - 870 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER
|
NEC
|
| SKY77602 |
Multi-Band, Multi-Mode (3G) Power Amplifier Module w/ PA Distribution Switch
|
Skyworks Solutions Inc.
|
| DPS128M8H3-12M DPS128M8J3-70C |
128K X 8 STANDARD SRAM, 120 ns, CQFP48 HERMETIC SEALED, CERAMIC, GULLWING, MODULE, SLCC-48
128K X 8 STANDARD SRAM, 70 ns, CQCC48 HERMETIC SEALED, CERAMIC, J LEADED, MODULE, SLCC-48
|
Data Delay Devices, Inc.
|
|
